Designed by engineers at the Palo Alto Research Center (a division of Xerox), chips can be applied in tens and hundreds with special printers on a flat surface. Apparently, the American military agency DARPA was seriously interested in this technology. The new project involves the creation of modular computers based on different sets of chipsets.

It is not yet clear what the size and shape of the chipset are. All this depends on the specialists who will help DARPA to translate their vision into reality, and it will be the third-party companies that will be engaged in the project with direct financing from the military budget. It may well be that as a result, the components will be large enough and they can be changed by hand, in the likeness of replacing the memory slots. But it may happen that the chipsets can be changed only in the factory with special equipment.

In any case, this system is much more flexible than the one to which we are all accustomed. As a result, the electronics should significantly decrease in size, become more focused on the tasks assigned to it, and also cheaper in production. Given that many military computer systems are now hopelessly outdated, the introduction of a completely new system will allow us to update the "arsenal" of electronics and catch up with existing technologies.